Microscopic sub- and final assemblies comprised of laser processing, bonding (micro-dispensing), laser welding, crimping, laminating and heat shrink application.  Complimented by inspection services to include SPC (statistical process control).  


  • Machining of complex structures, temperature-sensitive materials (polymer and metals), wires, electronic circuits and sensors, bioabsorbables, interocular lenses, catheters.   
  • Advantages are mitigation of heat damages and clean micro-scaled features, requiring minimal if any secondary processing.  
  • Ability to add gases to the laser processing enables control of temperature as well as surface modification affects.

  • UV
  • Epoxy
  • Cyanoacrylate
  • Conductive
  • Implantable adhesive systems
  • Failure analysis testing compliment these services

Unique shaped wire assemblies and arrays using silver-soldering, brazing, welding, adhesives and other methods.  


  • In-vivo polymer and metal components to include stents, valves, bioabsorbables, interocular lenses and catheters.  
  • Unique shaped wire assemblies and arrays using silver-soldering, brazing, welding, adhesives and other methods.
  • Integrated micro-markers bands for radiopacity
  • Centerless profile grinding and proprietary grinding services with micron sized tolerances and taper lengths.  

  • Precision to 5 microns
  • Electrical Discharge Machining

Nitinol films 1 – 85 microns for BioMEMs, sensors and electronic sensors.   


Precious metals and alloys


  • Deburring
  • Radiusing
  • Forming

  • Braiding, Forming, and Winding
  • Micro-braiding in continuous or discrete lengths in wire sizes to below .001”. Customer requirements for surface coverage, braid angle, expansion ratio, porosity, pick count gradients and material combinations guide production. 
  • Laser machining of micron-sized strut and kerf widths at production feed rates